| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of grinding a wafer that can expose all embedded electrodes on a reverse surface of the wafer. SOLUTION: The method of grinding the wafer includes: a predetermined load current value storing step of previously storing, as a predetermined load current value, a load current value of a motor when all the embedded electrodes are exposed on the reverse surface of the wafer when the reverse surface of the wafer is ground; a surface protecting step of arranging a protective member on a top surface of the wafer; a holding step of sucking and holding the side of the wafer where the protective member is arranged by a chuck table; a reverse surface grinding/load current value measuring step of performing grinding feeding of a grinding means to grind the reverse surface of the wafer held by the chuck table and also measuring the load current value of the motor during the grinding; a load current value determining step of determining whether the load current value of the motor during the grinding reaches the predetermined load current value; and a grinding-feeding stopping step of stopping the grinding feeding when the load current value of the motor reaches the predetermined load current value. COPYRIGHT: (C)2011,JPO&INPIT |
