ELECTRONIC CHIP EMBEDDED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: The object of the manufacturing method of the circuit board and the circuit board having within the electric component are as follows. CONSTITUTION: The manufacturing method of the circuit board and the circuit board having within the electric component. The inner side pattern formation stage and jointing step(S110), the acceptation hole formation step, and the device installing step is included(S130). The inner side pattern formation stage is that the inner side circuit pattern in one surface of the first substrate in which the electricity-conducting layer has and the second substrate is formed in both sides(S170).