发明名称 |
HIGH FLEXUOUS COPPER FOIL AND METHOD FOR PRODUCING THE SAME |
摘要 |
PURPOSE: A copper foil having improved elasticity and a manufacturing method thereof are provided to apply a copper foil to the bent portion of electronic devices. CONSTITUTION: A copper foil(40) is manufactured by treating the surface of an unprocessed copper foil by depositing copper particles through electroplating. It takes 80% of entire copper particles, the ratio of short diameter to long diameter is 0.4~0.9. Organic impurity content is 0.5% or less.
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申请公布号 |
KR20110018656(A) |
申请公布日期 |
2011.02.24 |
申请号 |
KR20090076234 |
申请日期 |
2009.08.18 |
申请人 |
LS MTRON LTD. |
发明人 |
PARK, JOON WOO;LEE, BYOUNG KWANG;KIM, SEUNG MIN;KIM, SOO YEOL |
分类号 |
C25D1/04;H05K1/09;H05K3/38 |
主分类号 |
C25D1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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