发明名称 HIGH FLEXUOUS COPPER FOIL AND METHOD FOR PRODUCING THE SAME
摘要 PURPOSE: A copper foil having improved elasticity and a manufacturing method thereof are provided to apply a copper foil to the bent portion of electronic devices. CONSTITUTION: A copper foil(40) is manufactured by treating the surface of an unprocessed copper foil by depositing copper particles through electroplating. It takes 80% of entire copper particles, the ratio of short diameter to long diameter is 0.4~0.9. Organic impurity content is 0.5% or less.
申请公布号 KR20110018656(A) 申请公布日期 2011.02.24
申请号 KR20090076234 申请日期 2009.08.18
申请人 LS MTRON LTD. 发明人 PARK, JOON WOO;LEE, BYOUNG KWANG;KIM, SEUNG MIN;KIM, SOO YEOL
分类号 C25D1/04;H05K1/09;H05K3/38 主分类号 C25D1/04
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