| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an improved method for laser processing that prevents material redeposition during laser ablation but allows material to be removed at a high rate. <P>SOLUTION: In a preferred embodiment, laser ablation is performed in a chamber filled with high pressure precursor gas (etching gas) so that sample particles ejected during laser ablation will react with the precursor gas in a gas atmosphere of the sample chamber. When the ejected particles collide with precursor gas particles, the precursor is dissociated, forming a reactive component that bonds to the ablated material. In turn, the reaction between the reactive dissociation by-product and the ablated material forms a new, volatile compound that can be pumped away in a gaseous state rather than redepositing onto the sample. <P>COPYRIGHT: (C)2011,JPO&INPIT |
