| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal foil polyimide laminate which can form fine wiring, and can obtain a low rate of a dimension change. SOLUTION: A metal foil polyimide laminate includes a non-thermoplastic polyimide layer 3 and a heat contact-bonding polyimide layer 4 laminated on one surface of the non-thermoplastic polyimide layer 3, and includes a polyimide film 1 having a thickness of 5-15μm, and metal foil 2 laminated on the heat contact-bonding polyimide layer 4. The non-thermoplastic polyimide layer 3 has a linear thermal expansion coefficient of 10 ppm/K or higher which is not higher than that of the metal foil 2, and the heat contact-bonding polyimide layer 4 has a linear thermal expansion coefficient of 40-60 ppm/K. The metal foil 2 has an Ef of 2.0 or larger when a thickness of wiring is Tc, a width of a top side of the wiring is Wt, a width of a bottom side of the wiring is Wb, and an etching factor Ef is defined as Ef=(2×Tc)/(Wb-Wt) when patterning is performed by an etching method. COPYRIGHT: (C)2011,JPO&INPIT |
