发明名称 PRINTED CIRCUIT BOARD ASSEMBLY
摘要 PROBLEM TO BE SOLVED: To provide a printed circuit board that transmits signals having very high data density. SOLUTION: The printed circuit board assembly 10 has a pair of printed circuit boards 12, 14. Each of the printed circuit boards 12, 14 has conductor vias 22 passing through from a surface of a dielectric 16 to an inner area 17 of the dielectric 16, and has a reference potential layer 20 and a signal conductor placed parallel to the reference potential layer 20, to form a transmission line having a predetermined impedance. In the printed circuit board assembly, a first electrical connector 34 having signal contacts 38 connected to the conductor vias 22 of the one board 12 is formed, and a second electrical connector 32 having signal contacts 36 connected to the conductor vias 22 of the other board 14 is formed. The first signal contacts 38 of the first electrical connector 34 are arranged to be electrically connected to the second signal contacts 36 of the second electrical connector 32. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011040785(A) 申请公布日期 2011.02.24
申请号 JP20100237237 申请日期 2010.10.22
申请人 TERADYNE INC 发明人 COHEN THOMAS S;GAILUS MARK W;STOKOE PHILIP P
分类号 H05K1/14;H05K1/02;H05K1/11;H05K3/30;H05K3/34;H05K3/36;H05K3/42 主分类号 H05K1/14
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