| 摘要 |
PROBLEM TO BE SOLVED: To provide a carrier device capable of carrying a wafer not in contact with a pattern formed on a reverse surface of the wafer. SOLUTION: The carrier device 100 which carries the wafer 91 includes two wall parts 10c, 10g formed on an upper surface of a feeder arm 10 so as to face each other with a reference point O in the center, and configured to restrict horizontal movements of the wafer 91, support parts 10d, 10e formed on the wall parts 10c, 10g low on sides of the reference point O, and configured to support a circumferential edge of a lower surface of the wafer 91, and a relief part 10f formed low between the two support parts 10d, 103. Shapes of borders of the support portions 10d, 10e between the wall portions 10c, 10g are formed as parts of a circle around the reference center O as its center and having a diameter larger than the diameter of the wafer 91, and shapes of borders of the support portions 10d, 10e between the relief portion 10f are formed as parts of a circle around the reference point O as its center and having a diameter smaller than the diameter of the wafer 91. COPYRIGHT: (C)2011,JPO&INPIT
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