| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless plating apparatus which can decrease the fluctuation of a temperature and a concentration of a predetermined component in a plating solution for an article to be plated while plating a plurality of the articles to be plated, and can reduce the amount of a waste liquid. SOLUTION: A control system 31 conducts an analysis and supply treatment of: setting a valve for analysis corresponding to one plating tank which is an object to be charged among first to fifth plating tanks 2, 3, 4, 5 and 6, to an open state; also driving a pump for the analysis and supplying a nickel plating solution 33 in one plating tank to an analysis section 41; calculating the amount of a replenishing liquid to be supplied which is added in order to adjust the concentration of the predetermined component in the nickel plating solution 33 in one plating tank to the predetermined concentration, based on the analysis results of the analysis section 41; and supplying the calculated amount of the replenishing liquid to be supplied, to one plating tank. The control system 31 repeats the analysis and supply treatment by sequentially changing the plating tank to be charged according to a predetermined charging order. COPYRIGHT: (C)2011,JPO&INPIT
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