| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering system where the mounting operability of a sputtering cathode and the uniformity of film deposition can be secured. SOLUTION: The sputtering system concerning to the embodiment has a conversion mechanism where, when a target unit 21 is subjected to attachment/detachment operations to a space part 19, a target 31 confronted with a rib 18 can be converted from a first state where it is confronted with the rib 18 to a second state where it is not confronted with the rib 18. In this way, upon the attachment/detachment of the target unit 21, the interference between the target part 31 and the rib 18 can be prevented, and satisfactory operability can be secured. Further, since the continuity or arrangement symmetry of the target parts 31 to 33 can be secured to the surface of a substrate stored in the space part 19, the uniformity of the film deposition to the whole surface of the substrate can be secured. COPYRIGHT: (C)2011,JPO&INPIT
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