发明名称 POSITIONING MECHANISM AND GRINDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a positioning mechanism capable of improving workability of an adjustment work for a mounting position of abutting blocks and obtaining high positioning accuracy, in a device for positioning a workpiece supported by an annular frame, and a grinding device. SOLUTION: The positioning mechanism includes a mounting table 25 mounted with a work unit 71 that supports a semiconductor wafer W on the annular frame 72, and two pairs of the abutting blocks in which four of the blocks are disposed so as to surround a target positioning position of the mounting table 25 and face each other across the target positioning position, and abut outer peripheral surfaces of the work unit 71. The two pairs of the abutting blocks consist of flat abutting blocks 27 having flat abutting faces and a protruded abutting block 28 having a curved abutting surface. At least one of the respectively opposing abutting blocks is made movable toward and away from the others and the annular frame 72 has flat surfaces for face-contacting with the flat abutting blocks 27. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011036968(A) 申请公布日期 2011.02.24
申请号 JP20090188215 申请日期 2009.08.17
申请人 DISCO ABRASIVE SYST LTD 发明人 YAMANAKA SATOSHI
分类号 B24B41/06;B24B7/04;H01L21/304 主分类号 B24B41/06
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