发明名称 PACKAGING MOLDED BODY
摘要 PROBLEM TO BE SOLVED: To provide a packaging molded body capable of satisfying the see-through property and the blocking resistance of a resin film in applications in which a window hole is covered with the resin film from the inner side of the packaging molded body, and a heat-adhesive layer and a paper surface are heat-adhered to and joined with each other. SOLUTION: In the packaging molded body having a paper-made envelope shape or a box shape having a window hole 30 with the window hole being covered with a resin film, a part of or the whole of the window hole, and its peripheral paper part are covered from the inner side of the packaging molded body with a heat-adhesive film in which a heat-adhesive layer as a surface layer and an unoriented polyolefin layer as a base layer are piled up on each other, and the heat-adhesive layer side of the heat-adhesive film is heat-adhered to the peripheral paper part. The heat-adhesive layer consists of at least one kind of copolymer to be selected from (A) ethylene-α-olefin copolymer polymerized by using a single site catalyst, (B) ethylene-vinyl acetate copolymer, and (C) ethylene-(meth) acrylic ester copolymer. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011037466(A) 申请公布日期 2011.02.24
申请号 JP20090185239 申请日期 2009.08.07
申请人 J-FILM CORP 发明人 SAKOGAWA KOUICHI;MEGURO TAKETSUGU;URAGUCHI MASAKI;MIURA AKIRA
分类号 B65D65/40;B32B3/26;B32B27/10 主分类号 B65D65/40
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