发明名称 HEAT EQUALIZER AND ORGANIC FILM FORMING APPARATUS
摘要 A heat equalizer includes a container structure having a heating block in which a working fluid is held for heating and vaporizing a material to be heated, a heater placed at the bottom of the container structure, and a material feed pipe allowing the outside and the inside of the container structure to communicate with each other. In the heating block, as a flow path in which the material to be heated flows, a main header pipe connected to the material feed pipe and extending in the horizontally, and a riser pipe branching from the main header pipe and extending vertically are formed. As a condensation path in which the working fluid is cooled and condensed, condensation holes formed respectively on the opposite sides of the riser pipe and extending horizontally, and a condensation pit formed under the riser pipe are formed. Between the condensation holes and the condensation pit, the main header pipe is placed.
申请公布号 US2011041768(A1) 申请公布日期 2011.02.24
申请号 US20080934190 申请日期 2008.04.11
申请人 NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY;TOSHIBA MITSUBISHI-ELECTRIC INDUS. SYS. CORP. 发明人 OHMI TADAHIRO;KITANO MASAFUMI;YAMAKAGE HISAAKI;YAMADA YOSHIHITO
分类号 C23C16/00;F28D15/00 主分类号 C23C16/00
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