发明名称 PROCESSING LIQUID FOR SUPPRESSING PATTERN COLLAPSE OF FINE METAL STRUCTURE, AND METHOD FOR PRODUCING FINE METAL STRUCTURE BY USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a processing liquid capable of suppressing pattern collapse of a fine metal structure such as a semiconductor device or a micromachine, and to provide a method for producing a fine metal structure by using the processing liquid. <P>SOLUTION: This invention relates to: the processing liquid for suppressing pattern collapse of the fine metal structure containing phosphate and/or polyoxyalkylene ether phosphate; and the method for producing the fine metal structure whose pattern is selected out of titanium nitride, titanium, ruthenium, ruthenium oxide, tungsten, tungsten silicide, tungsten nitride, aluminum oxide, hafnium oxide, hafnium silicate, hafnium nitride silicate, platinum, tantalum, tantalum oxide, tantalum nitride, nickel silicide, nickel silicon germanium, and nickel germanium. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011040502(A) 申请公布日期 2011.02.24
申请号 JP20090185124 申请日期 2009.08.07
申请人 MITSUBISHI GAS CHEMICAL CO INC 发明人 OTO HIDE;MATSUNAGA HIROTSUGU;YAMADA KENJI
分类号 H01L21/027 主分类号 H01L21/027
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