发明名称 |
MULTILAYER WIRING SUBSTRATE HAVING CAVITY PORTION |
摘要 |
The present invention provides a multilayer wiring substrate comprising: a plurality of wiring substrate laminated each other; and a cavity portion. In the multilayer wiring substrate, a wiring substrate 1 being arranged along the bottom face of the cavity portion and a wiring substrate 2 being arranged at an upper layer side of the wiring substrate 1, the wiring substrate 1 and/or the wiring substrate 2 respectively comprising an insulating base material having a predetermined properties, the wiring substrate 2 being provided with a cavity hole. Thus, it is possible to provide a multilayer wiring substrate having a cavity portion and even a function of reflector.
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申请公布号 |
US2011042124(A1) |
申请公布日期 |
2011.02.24 |
申请号 |
US20080745651 |
申请日期 |
2008.12.03 |
申请人 |
MITSUBISHI PLASTICS, INC. |
发明人 |
MATSUI JUN;YAMADA SHINGETSU |
分类号 |
H01B17/00;H05K1/00;H05K3/00;H05K3/06 |
主分类号 |
H01B17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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