| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board and a manufacturing method thereof. SOLUTION: The printed circuit board includes: a circuit board having an internal circuit structure; an additional circuit structure provided on the circuit board and electrically connected to the internal circuit structure; a solder resist insulation layer that is provided on the additional circuit structure and has an opening; a conductive bump pattern that is provided inside the solder resist insulation layer and has a portion extending in the horizontal direction of the opening to expose its one side, part of the top surface, and part of the bottom surface out of the opening; and a solder ball formed in the opening and electrically connected to the additional circuit structure. COPYRIGHT: (C)2011,JPO&INPIT |
