发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A semiconductor package includes a substrate having an insulation layer. The insulation layer has a first region having a first surface roughness and a second region having a second surface roughness. A semiconductor chip is mounted in the first region, and an underfill resin solution is filled into the space between the semiconductor chip and the insulation layer. The roughness of the second region prevents the underfill resin from flowing out from the semiconductor chip to thereby reduce a size of the semiconductor package.
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申请公布号 |
US2011042797(A1) |
申请公布日期 |
2011.02.24 |
申请号 |
US20100857928 |
申请日期 |
2010.08.17 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD |
发明人 |
PARK JI-HYUN;KWON HEUNGKYU;NA MIN-OK;KIM TAEHWAN |
分类号 |
H01L23/00;H01L23/488;H01L23/498 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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