SEMICONDUCTOR DEVICE HAVING POWER SUPPLY-SIDE METAL REINFORCING MEMBER AND GROUND-SIDE METAL REINFORCING MEMBER INSULATED FROM EACH OTHER

摘要

Disclosed is a semiconductor device which comprises: a wiring board; a semiconductor chip that is affixed onto a first surface of the wiring board; a power supply pad that is provided on a second surface of the wiring board for the purpose of supplying electric power to the wiring board, said second surface being on the reverse side of the first surface; a ground pad that is provided on the second surface of the wiring board for the purpose of grounding the wiring board; a power supply-side metal reinforcing member that is connected to the power supply pad; a ground-side metal reinforcing member that is connected to the ground pad; and an insulating member that insulates the power supply-side reinforcing member and the ground-side reinforcing member from each other.