| 摘要 |
<p>An apparatus and method for packaging an electronic device (12) that mechanically isolates the electronic device from its supporting substrate (38), eliminating transfer of mechanical stress from the substrate to the device. The apparatus includes a plurality of elongated members (26) that extend from a frame (14) support to a center opening, where the ends of the elongated members together support the electronic device. The shape, material and orientation of the elongated members combine to both support the electronic device and absorb mechanical force transmitted from the substrate to the support frame. In one example, the absorbing portion is substantially perpendicular to the direction of the transmitted force and the transmitted force is absorbed by mechanical displacement of one end of the perpendicular portion. The apparatus and method are particularly effective in eliminating the negative effects of thermal expansion mismatch between the electronic device and its supporting substrate.</p> |
