| 摘要 |
The present invention provides an aqueous platinum electroplating bath including: a) a source of platinum ions; and b) a source of polyphosphate anions, and wherein the bath has a pH in the range from about 2 to about 9 when it is in use or ready for use. The aqueous platinum electroplating bath may optionally include one or more levellers. The invention also provides the use of the platinum electroplating bath and platinum salts suitable for use in the bath. |
