| 摘要 |
PROBLEM TO BE SOLVED: To achieve a configuration that is suitable for miniaturization and can appropriately perform the wire bonding of both wiring boards in an electronic device in which the two wiring boards are connected by wire bonding. SOLUTION: The electronic device comprises a flat support substrate 10, a first wiring board 20 bonded by allowing a rear 22 to oppose the side of one surface 11 of the support substrate 10, and a second wiring board 30 bonded by allowing a rear 32 to oppose the side of the other surface 12 of the support substrate 10. The edge of the first wiring board 20 and that of the second one 30 are bonded and fixed to the support substrate 10. A through-hole 10a, which passes through one surface 11 to the other 12, is provided on the support substrate 10. A part existing at the inner periphery as compared with the edge in the rear 32 of the second wiring board 30 is exposed from the through-hole 10a. The surface 21 of the first wiring board 20 is bonded to the rear 32 of the second one 30 by a bonding wire 60 via the through-hole 10a for electric connection. COPYRIGHT: (C)2007,JPO&INPIT |
