Electronic component and manufacturing method thereof

摘要

The electronic component includes a base material (5), a capacitor unit (10), and a wiring portion (40). The capacitor unit (10) has a stacked structure including a first electrode portion (11) provided on the base material (5), a second electrode portion (12) including a first surface opposing the first electrode portion (11) and a second surface opposite to the first surface, and a dielectric portion (13) interposed between the electrode portions (11, 12). The wiring portion (40) includes a via portion (43) having a surface on the base material side, and joined to the second surface of the second electrode portion via the surface on the base material side. The surface of the via portion on the base material side includes an extended portion (43a") extending outward of the periphery of the second surface of the second electrode portion (12).