| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a tablet for sealing a semiconductor capable of reducing the occurrence of a void within a package by increasing the density of the tablet. SOLUTION: The manufacturing method for the tablet for sealing the semiconductor comprises producing an epoxy resin composition containing the following components (A)-(C) as essential components, thereafter molding a kneaded product of the above composition into a sheet-like product having a sheet density ratio of 98 % or higher, crushing the sheet-like product, thereafter tabletting the crushed material into a tablet-like product having a tablet density ratio of 94 % or higher and lower than 98 %. (A): an epoxy resin. (B): a phenol resin. (C): an inorganic filler. COPYRIGHT: (C)2005,JPO&NCIPI |
