| 摘要 |
PROBLEM TO BE SOLVED: To facilitate handling, and to resist an environmental test in a mounting substrate on which a bare chip IC is loaded. SOLUTION: Sections on which an electronic part and the bare chip IC are loaded are formed in recessed sections by laminating a lower-side substrate 21 with a circuit pattern and an upper-side substrate 26 with a pattern in which parts are opened, the electronic part and the bare chip IC 32 are loaded in the recessed sections and wire-bonded, and the recessed sections are sealed by an epoxy resin 4. |
