发明名称 |
System and method for numerically evaluating thermal comfort inside an enclosure |
摘要 |
<p>A system and method for assessing thermal comfort in an enclosure is disclosed. In one embodiment, a method includes performing a numerical analysis on a calibration enclosure including a thermal manikin in a uniform thermal environment to obtain a surface heat transfer coefficient (heal) for each body part of the thermal manikin. The method also includes performing a numerical analysis on an enclosure including one or more thermal manikins in a non-uniform thermal environment to obtain a total heat flux (q" T ) for each body part of the one or more thermal manikins. The method further includes computing an equivalent temperature (t eq ) of each body part of the one or more thermal manikins using the obtained associated h cal , the obtained associated q" T , and an associated surface temperature of the body part. Furthermore, the method includes evaluating thermal comfort in the enclosure based on each computed t eq .</p> |
申请公布号 |
EP2287758(A1) |
申请公布日期 |
2011.02.23 |
申请号 |
EP20100165570 |
申请日期 |
2010.06.10 |
申请人 |
AIRBUS ENGINEERING CENTRE INDIA;AIRBUS OPERATIONS GMBH |
发明人 |
TIWARI, PUNIT;REDDY, MADHUSUDHANA;WICK, ANDREAS |
分类号 |
G06F17/50;G01W1/17 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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