发明名称 System and method for numerically evaluating thermal comfort inside an enclosure
摘要 <p>A system and method for assessing thermal comfort in an enclosure is disclosed. In one embodiment, a method includes performing a numerical analysis on a calibration enclosure including a thermal manikin in a uniform thermal environment to obtain a surface heat transfer coefficient (heal) for each body part of the thermal manikin. The method also includes performing a numerical analysis on an enclosure including one or more thermal manikins in a non-uniform thermal environment to obtain a total heat flux (q" T ) for each body part of the one or more thermal manikins. The method further includes computing an equivalent temperature (t eq ) of each body part of the one or more thermal manikins using the obtained associated h cal , the obtained associated q" T , and an associated surface temperature of the body part. Furthermore, the method includes evaluating thermal comfort in the enclosure based on each computed t eq .</p>
申请公布号 EP2287758(A1) 申请公布日期 2011.02.23
申请号 EP20100165570 申请日期 2010.06.10
申请人 AIRBUS ENGINEERING CENTRE INDIA;AIRBUS OPERATIONS GMBH 发明人 TIWARI, PUNIT;REDDY, MADHUSUDHANA;WICK, ANDREAS
分类号 G06F17/50;G01W1/17 主分类号 G06F17/50
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