发明名称 WARM FLOOR DATA CENTER
摘要 <p>A data center cooling system includes a floor structure defining a below-floor warm-air plenum and an above-floor cool air plenum, a plurality of above-floor computer assemblies arranged to exhaust warmed air into the warm-air plenum, and one or more fan-coil arrangements to draw air from the warm-air plenum, cool the air, and provide the air to the cool air plenum. The volume of the above-floor cool air plenum and the below-floor warm air plenum may both be substantial so as to minimize changes in temperature from the failure of components in the system.</p>
申请公布号 KR20110017849(A) 申请公布日期 2011.02.22
申请号 KR20107024573 申请日期 2009.03.31
申请人 EXAFLOP LLC 发明人 CARLSON ANDREW B.;CLIDARAS JIMMY;HAMBURGEN WILLIAM
分类号 F24F7/10;F24F7/06;F24F11/02 主分类号 F24F7/10
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