发明名称 |
Manufacturing process of embedded type flexible or rigid printed circuit board |
摘要 |
A manufacturing process of an embedded type flexible or rigid printed circuit board includes multiple steps. First, a layer of dry film is applied to a layer of copper foil. Then a circuit pattern is formed on the copper foil through photolithography processes. An etching stop layer is electroplated on the copper foil according to the circuit pattern. The etching stop layer is then electroplated with copper. The copper foil is softened by a high temperature process after removing the dry film. Then the layer of the copper foil is etched after coating with an organic layer and the organic layer is solidified.
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申请公布号 |
US7892412(B2) |
申请公布日期 |
2011.02.22 |
申请号 |
US20070850830 |
申请日期 |
2007.09.06 |
申请人 |
MUTUAL-TEK INDUSTRIES CO., LTD. |
发明人 |
CHANG ROGER |
分类号 |
C25D5/02 |
主分类号 |
C25D5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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