发明名称 Thermal management for LED
摘要 A method and system for removing heat from an LED facilitates the fabrication of LEDs having enhanced brightness. A thermally conductive interposer can be attached to the top of the LED. Heat can flow through the top of the LED and into the interposer. The interposer can carry the heat away from the LED. Light can exit the LED though an at least partially transparent substrate of the LED. By removing heat from an LED, the use of more current through the LED is facilitated, thus resulting in a brighter LED.
申请公布号 US7892870(B2) 申请公布日期 2011.02.22
申请号 US20100701366 申请日期 2010.02.05
申请人 BRIDGELUX, INC. 发明人 SHI WEI
分类号 H01L21/00;H01L33/38;H01L33/48;H01L33/62;H01L33/64 主分类号 H01L21/00
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