OPTIC INTERCONNECTION DEVICE

摘要

PURPOSE: An optical wiring element is provided to implement the high speed operation of an electric circuit using the high carrier mobility of a germanium substrate. CONSTITUTION: A first semiconductor chip(301) is arranged on a germanium-on-insulator(GOI) substrate(300). An optical emitter(302) outputting an optical signal by receiving an electric signal from the semiconductor chip is arranged on the GOI substrate. An optical detector(304) detecting the optical signal and converts the optical signal into an electric signal is arranged on the GOI substrate. A second semiconductor chip receiving the electric signal from the optical detector is arranged on the GOI substrate.