发明名称 |
Seal ring structures with reduced moisture-induced reliability degradation |
摘要 |
A semiconductor chip includes a seal ring adjacent to edges of the semiconductor chip; an opening extending from a top surface to a bottom surface of the seal ring, wherein the opening has a first end on an outer side of the seal ring and a second end on an inner side of the seal ring; and a moisture barrier having a sidewall parallel to a nearest side of the seal ring, wherein the moisture barrier is adjacent the seal ring and has a portion facing the opening. |
申请公布号 |
US7893459(B2) |
申请公布日期 |
2011.02.22 |
申请号 |
US20070786076 |
申请日期 |
2007.04.10 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
WANG CHIEN-JUNG;LIN JIAN-HONG |
分类号 |
H01L29/02 |
主分类号 |
H01L29/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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