BALL GRID ARRAY(BGA) PACKAGE BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A ball grid array package substrate and a manufacturing method thereof are provided to improve the mechanical and electrical property by increasing the boundary attaching force between the solder ball and the solder ball land. CONSTITUTION: A conductive trace(120) is formed on the upper side of a substrate(110). A solder mask(140) comprises an opening defining the area of a solder ball land(125). A bump(135) is formed on the upper side of the conductive trace. The bump is formed in conductive material. A solder ball(150) is attached on the solder ball land.