发明名称 COMPOSITION OF MATERIAL FOR THERMAL INSULATION
摘要 <p>The invention pertains to building materials, in particular to thermal and sound insulation materials and filler-type building materials made of foamed plastics. The objective of invention is development of foaming compound for more plastic and flexible, non-fragile, surface non-friable thermal insulation material with low content of escaping formaldehyde. The result of development is compound for thermal insulation material with the following amounts of components in mass parts (%): carbamide and formaldehyde resin - from 42 to 51; surfactant - from 0.2 to 0.3; hardener - from 0.2 to 0.3; polyethylene glycol - from 0.6 to 0.8; phlogopite - from 0.9 to 1.9; organic and mineral fertilizer containing ammonia on the basis of bio-humus - from 0.9 to 1.9; water - the remaining amount.</p>
申请公布号 LV14292(A) 申请公布日期 2011.02.20
申请号 LV20100000143 申请日期 2010.10.14
申请人 THERMEKO, SIA 发明人 TIMOFEJEVS JURIJS
分类号 C08L61/00;C04B24/00;C04B40/00 主分类号 C08L61/00
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