| 摘要 |
PURPOSE: A wafer cleaning apparatus and a method thereof are provided to solve the problem of defective device due to the corrosion of the pad by implementing the cleaning process by cleansing water spraying, dipping, and pure water dipping. CONSTITUTION: A plurality of wafers(W) is dipped in a cleaning tub(1). A cleaning solution supplying unit(20) supplies the cleaning solution inside the cleaning tub. A nozzle(25) sprays the cleansing water supplied from the cleaning solution supplying unit towards the wafer accepted within the cleaning tub. A DIW supply unit(10) supplies the DIW inside the cleaning tub.
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