发明名称 POLISHING UNIT AND SUBSTRATE TREATING APPARATUS AND METHOD INCLUDING THE UNIT
摘要 PURPOSE: A grinding unit, a substrate process apparatus including the same, and a method thereof are provided to improve the productivity by reducing the required time by grinding the substrate simultaneously using a plurality of grinding pads. CONSTITUTION: A substrate support unit(100) supports a substrate. A container unit(200) retrieves the fluid distributed from the rotating substrate. A grinding unit(300) grinds the substrate supported by the substrate support unit. A processing liquid supplying unit(500) supplies the processing liquid which is offered for cleaning and grinding.
申请公布号 KR20110016703(A) 申请公布日期 2011.02.18
申请号 KR20090074331 申请日期 2009.08.12
申请人 SEMES CO., LTD. 发明人 KWON, OH JIN;AN, HYO JUN
分类号 H01L21/304 主分类号 H01L21/304
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