| 摘要 |
PURPOSE: A substrate test method is provided to test the connection state of an active device and an external circuit layer, and identify the connection state of connection circuit layer between the active devices without comprising additional test circuit layer. CONSTITUTION: In the connection stage, a first test terminal is connected to a first external circuit layer(11) connected with the first connection pad of a first active device(1) built in the substrate. A second test terminal is connected to a second external circuit layer(13) connected with the second connection pad of the first active device.
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