| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor chip built-in package and a POP (Package-On-Package) semiconductor device which can reduce manufacturing cost, shorten a manufacturing time, and make a product low in price; and to provide methods of manufacturing those. <P>SOLUTION: The semiconductor chip built-in package is manufactured by: including a ball pad 114 and a semiconductor chip 115 on a glass epoxy substrate 111; solder-joining a first ball 121 on the ball pad 114; forming a POP pad 119 on a stainless steel plate; solder-joining a second ball 122 thereupon; placing the stainless steel plate on the glass epoxy substrate 111; solder-joining the first ball 121 and second ball 122; sealing the semiconductor chip 115, and an electrode portion 118 comprising the first ball 121, second ball 122, and solder 123 with a mold resin 120; and peeling the stainless steel plate. The first ball 121 and second ball 122 respectively have core parts 121a and 122a having glass transition points higher than the melting point of the solder 123. <P>COPYRIGHT: (C)2011,JPO&INPIT |
