| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device reducing warpage of a package caused by heat generation when using the semiconductor device and a semiconductor device operating temperature environment, and hence effectively suppressing a fatigue fracture of a solder layer for bonding a substrate to the package. <P>SOLUTION: In the semiconductor device 20, a semiconductor package 10 is formed of a semiconductor element 1, a heat radiation pad 3, electrodes 4, 5, a conductor 6 for connecting the semiconductor element 1 to the electrodes 4, 5, and an encapsulating resin body 7 for sealing them, and the solder layer 9 bonds the semiconductor element 1 to the exposed section of the electrodes 4, 5 and the substrate 8. A through-hole 3a, which extends from a surface at a side for mounting a semiconductor element to a surface on a side of a solder layer junction section, is opened in the heat radiation pad 3, a hole width t1 of a region 3a1 corresponding to a diagonal line L of the heat radiation pad 3 is relatively large in a plan view of the through-hole 3a, and a hole width t2 shows a small shape as they are separated from the diagonal line. <P>COPYRIGHT: (C)2011,JPO&INPIT |
