| 发明名称 |
CMOS IMAGE SENSOR BIG VIA BONDING PAD APPLICATION FOR AlCu PROCESS |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a CMOS image sensor big via bonding pad application for AlCu process. <P>SOLUTION: An integrated circuit includes a substrate having a bonding pad region and a non-bonding pad region. A relatively large via, called a "big via", is formed on the substrate in the bonding region. The big via has a first dimension in a top view toward the substrate. The integrated circuit also has a plurality of vias formed on the substrate in the non-bonding region. The plurality of vias each have a second dimension in the top view and the second dimension is considerably smaller than the first dimension. <P>COPYRIGHT: (C)2011,JPO&INPIT |
| 申请公布号 |
JP2011035399(A) |
申请公布日期 |
2011.02.17 |
| 申请号 |
JP20100170162 |
申请日期 |
2010.07.29 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD |
发明人 |
TSENG UWAY;WU LIN-JUNE;LIN YU-TING |
| 分类号 |
H01L21/3205;H01L21/60;H01L21/768;H01L23/52;H01L27/14;H01L27/146 |
主分类号 |
H01L21/3205 |
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