| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for sticking a protective tape capable of suppressing the generation of the warpage of a semiconductor wafer after a back-grinding step. <P>SOLUTION: The protective tape T is supplied toward a semiconductor wafer W which is held on a chuck table 1 by suction, an intermediate sheet TS is supplied along the upper side of the protective tape T, and by relatively moving a sticking member 18 and the semiconductor wafer W horizontally in a state that the intermediate sheet TS is disposed between the sticking member 18 and the protective tape T, the protective tape T is stuck on the surface of the semiconductor wafer W. By thrusting a cutter blade 9 of a protective tape cutting mechanism 6 to the intermediate sheet TS and the protective tape T and turning and running it, the protective tape T is cut into a shape of the semiconductor wafer W. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
