发明名称 THERMAL TRANSFER APPARATUS
摘要 PROBLEM TO BE SOLVED: To allow good workability, miniaturization, uniformity and rapidity to a heating and cooling mechanism of thermal transfer apparatus which is a thermal nano-imprinting means for thermal transfer of a fine configuration. SOLUTION: The thermal transfer apparatus for thermal transferring the fine configuration is equipped with a pressurizing section 1, a pressure receiving section 2 and a transfer section 10 provided with heating and cooling capacity and arranged between the pressurizing section and the pressure receiving section. The transfer section is loaded with a heating and cooling member on a surface of heat insulating member which forms an insulating layer, wherein a plurality of holes are prepared in parallel to circulate a cooling medium inside for cooling the transfer section while a hole is prepared to insert a heating medium inside. Also, a through hole is prepared up and down through a part of the heat insulating member so as to communicate with a hole formed in the heating and cooling member. A plurality of holes are prepared in the pressurizing section or the pressure receiving section through the heat insulating member so as to communicate with the hole formed in the heating and cooling member. A seal material which consists of an O-ring is prepared in a joint between the transfer section and the pressurizing section or the pressure receiving section. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011031547(A) 申请公布日期 2011.02.17
申请号 JP20090181752 申请日期 2009.08.04
申请人 HITACHI INDUSTRIAL EQUIPMENT SYSTEMS CO LTD 发明人 SHIMAO DAISUKE
分类号 B29C59/00;B29C33/02;B29C43/52;B29C59/02 主分类号 B29C59/00
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