OPTICAL ETCHING DEVICE FOR LASER MACHINING

摘要

An optical etching device for laser machining is provided and includes a laser light source and an optical head. The laser light source emits an incident beam. The optical head includes a transparent substrate, an opaque film and a sub-wavelength annular channel. The laser energy tolerance of the transparent substrate ranges from 8 J/cm2 to 12 J/cm2. The opaque film has a first surface and a second surface opposite to the first surface. The transparent substrate is adhered to the first surface. The sub-wavelength annular channel is formed in the opaque film and extends from the first surface to the second surface so that the incident beam from the transparent substrate generates a surface plasma wave on the opaque film.