| 摘要 |
PURPOSE: A semiconductor package is provided to reduce the entire height of the package by electrically connecting semiconductor chips in each module through a through electrode. CONSTITUTION: A substrate(110) includes a bond finger(112) and a ball land on both the upper side and the lower side. Chip modules(120) are stacked in a zigzag shape in order to protrude the connecting parts of first connecting units. The stacked chip module and the substrate are electrically connected through a metal wire(140). A second connecting unit connects the first connecting unit of each chip module and the bond finger of the substrate. A sealing unit(150) seals hermetically the upper side of the substrate including stacked chip modules the second connecting unit. |
