发明名称 |
TEMPLATE FOR FORMING SOLDER BUMPS, METHOD OF MANUFACTURING THE SOLDER BUMPS USING THE SAME |
摘要 |
PURPOSE: A solder bump forming template and a solder bump forming method using the same is provided to prevent the bending of the template due to the thermal expansion during formation of the solder pump by forming a first cavity on a first surface and a second cavity on a second surface, respectively. CONSTITUTION: A flat substrate comprises a first side(110) and a second side facing the first side. A plurality of first cavities(112) is formed on the first side of the flat substrate. A plurality of second cavities is formed on the second side of the flat substrate. A pass-through slot(130) passing through the flat substrate is formed being spaced from the plurality of first cavities. |
申请公布号 |
KR20110016339(A) |
申请公布日期 |
2011.02.17 |
申请号 |
KR20090073997 |
申请日期 |
2009.08.11 |
申请人 |
STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD. |
发明人 |
CHUN, JUNG HWAN |
分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|