A VACUUM CHUCK USED IN SEMICONDUCTOR MANUFACTURING FACILITIES WITH OUTSIDE TIPS

摘要

PURPOSE: A vacuum chuck with an external tip is provided to improve cell acquisition yield by satisfying the wafer planarity standard value of cells which are located at outer circumference of a wafer. CONSTITUTION: A chuck body(110) is formed into the same shape as a wafer. An internal tip for fixing the wafer(120) is formed on the upper side of the chuck body in a fixed interval in order to support the rear side of the wafer. An external tip for fixing the wafer(130) surrounds a vacuum region which is formed by the internal tip for fixing the wafer. An ejection pin moving hole(140) is formed to pass through the chuck body. A vacuum hole(150) is formed to pass through the chuck body in order to transfer a vacuum pressure to the vacuum region.