| 摘要 |
PROBLEM TO BE SOLVED: To safely extract a thin plate from a thin plate container with a robotic device and the like, without being affected by the own weight, even in the case of a thin plate such as a large diameter wafer. SOLUTION: The thin plate container includes a plurality of thin plate supporting sections 12 for supporting the thin plates by being disposed so as to project toward a space S for storing the thin plate. Further, the plurality of the thin plate supporting sections 12 are arranged side by side in the horizontal direction, and arranged so as to be tilted at a predetermined angleαfrom the vertical direction toward the arranged direction to support the thin plate in a tilted state toward the vertical direction. COPYRIGHT: (C)2011,JPO&INPIT |
