SEMICONDUCTOR PACKAGE-INCORPORATED WIRING BOARD, AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To solve various problems caused by heat generation of a semiconductor package by effectively dissipating heat generated from the semiconductor package, in a semiconductor package-incorporated wiring board formed by embedding a semiconductor package in an insulation member.

SOLUTION: This semiconductor package-incorporated wiring board is composed by including: a semiconductor package embedded in at least one of a plurality of first insulation members respectively located among a plurality of first wiring patterns; a heat radiation member arranged to contact a principal surface of the semiconductor package located on a non-functional surface side of a semiconductor chip constituting the semiconductor package; and a plurality of inter-layer connection bodies for electrically connecting at least partial parts of the plurality of first wiring patterns to one another, and at least partial parts of the plurality of wiring patterns to the semiconductor chip; and thermally connecting the heat radiation member to at least one of the plurality of inter-layer connection bodies.

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