发明名称 CHIP COMPONENT BONDING DEVICE, AND CHIP COMPONENT BONDING METHOD
摘要 PROBLEM TO BE SOLVED: To stabilize characteristic of an optical module by preventing dimensional nonuniformity in height direction between a mounting surface of substrate and a light receiving/emitting surface of optical element, which is caused by the effect of thickness dimension tolerance of the optical element, thickness dimension tolerance of an electrode of the substrate on which the optical element is mounted, and deflection deformation of the substrate when the optical element is mounted on the substrate. SOLUTION: The light receiving/emitting surface of the optical element is so fixed on the upper surface of a mounting stage as to be tightly contacted. A displacement of a Z stage when either a reference surface of a substrate fixed to the lower surface of the Z stage on which the substrate is mounted and pressurized or a reference surface of a seat provided to the substrate is contacted to the upper surface of the mounting stage, is stored. Then, to perform mounting with a wanted displacement, the Z stage is controlled by a Z drive mechanism and a controller so that the optical element and the substrate are joined together through a joining material. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011035109(A) 申请公布日期 2011.02.17
申请号 JP20090178915 申请日期 2009.07.31
申请人 NEC CORP 发明人 YAMAMOTO KEISUKE;KURIHARA MITSURU;SUGIMOTO TAKARA;ODA MIKIO
分类号 H01L21/52;H05K3/34 主分类号 H01L21/52
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