SYSTEM AND METHOD FOR PICKING AND PLACEMENT OF CHIP DIES

摘要

According to an aspect of the invention, there is provided a chip die manipulator apparatus arranged for pick and placing of a chip die (30) in a chip manufacturing process, comprising: a pickup head arranged to pick up the chip die with an active side facing the first pickup head (11); a second pickup head (21) arranged to perform a flip chip movement of the chip die (30), to have the active side facing away from the second pickup head (21), wherein the first pickup head (11) comprises a test card (12) comprising contact pads arranged to contact the active side of the chip die (30); and a clamp for clamping the chip die against the contact pads. Advantages may include reduction of the number of process steps and providing less breakdown risk in the manufacturing process due to in-place testing of chip dies.