| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic parts in which increase in electric resistance due to oxidation is suppressed, generation of air bubbles of glass or glass ceramics is suppressed, and a Cu based wiring material superior in migration resistance is used in the electronic parts in which the wiring and an electrode are manufactured by calcination from a paste, and the electronic parts having the wiring contacted with glass or a glass ceramics member. <P>SOLUTION: The electronic part is provided which has the wiring, the electrode, and a contact member contacted with the glass or the glass ceramics member, or which has the wiring, the electrode, and the contact member in which the paste is formed and calcined together with glass or glass ceramics, and is constituted of alloy powder particles containing Cu and Al. A surface of the alloy powder particles containing Cu and Al is covered by an oxidized Al film (Al<SB>2</SB>O<SB>3</SB>) of less than 80 nm. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
