| 摘要 |
PROBLEM TO BE SOLVED: To provide an imaging module to which an imaging element is fixed in parallel to a substrate, an imaging apparatus, and a method of manufacturing the imaging module. SOLUTION: The imaging module includes a substrate 2 on which a recessed part 24 is formed on a mounting surface 21 and an electrode for external connection is provided in the recessed part 24; the imaging element 3 mounted on the mounting surface 21 of the substrate 2; and a solder ball 4 for bonding the substrate 2 and the imaging element 3. In the state in which the substrate 2 and the imaging element 3 are bonded through the solder ball 4, a pair of end parts 33 opposing each other across the recessed part 24 at least of the substrate side surface 32 of the imaging element 3 are in surface contact with the mounting surface 22 surrounding the recessed part 24 of the substrate 2. COPYRIGHT: (C)2011,JPO&INPIT |
