| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of repairing a printed board pattern high in repair position correctness and capable of improving recovery performance of a peeled piece. SOLUTION: This method of repairing a printed board pattern includes processes of: imaging a surface of a printed board having conductive foil with a pattern formed thereon on the front surface by a camera, comparing an image obtained by the imaging with previously-stored layout design pattern information, and thereby identifying a pattern edge to be repaired; pressing a blade edge against the conductive foil of the printed board and using the tilt to bring the identified pattern edge close to a pattern by the layout design pattern information, and thereby separating a peeled piece from the conductive foil to be obtained; and irradiating the region on the printed board against which the blade edge is pressed with ultrasonic waves to liberate the peeled piece from the printed board, sucking the vicinity of the region by negative pressure, and thereby recovering the peeled piece. COPYRIGHT: (C)2011,JPO&INPIT |
